We manufacture and provide precision processing parts which are utilized in Bonding Instruments.
We provide the following products such as Capillaries used to connect Integrated Circuit Chips with Gold Wire Substrates, Wedges used for the Bonding Head for Hard Disk to Lead Frame, Air Tensions for Gold Wire Tension and Clampers to support the stretch of the wire.
All of these products require our highly accurate processing technology of hard materials, especially the smooth and accurate Capillary Forms required for the Bonding Process.
